Micron Technology Intensifies Recruitment for South Korean Semiconductor Talent
SEOUL, Oct. 19 — Micron Technology, the prominent U.S. memory chip manufacturer, is significantly amplifying its recruitment initiatives targeting South Korean semiconductor engineers, particularly those employed by major players such as Samsung Electronics and SK Hynix.
This strategic move is in response to the burgeoning competition within the high-bandwidth memory (HBM) sector, a market increasingly fueled by the surging demand linked to artificial intelligence advancements.
As reported by industry sources on October 19, Micron has been proactive in reaching out to Korean engineers via LinkedIn and local recruitment agencies. The firm aims to fill critical roles at its Taichung fabrication facility in Taiwan, a pivotal site for DRAM production and HBM manufacturing.
This recruitment campaign encompasses a broad spectrum of positions, from technical to executive levels. Offers feature competitive compensation packages, reportedly approaching 200 million won ($145,000), which include bonuses.
Moreover, Micron has expanded its outreach to employees at foreign semiconductor equipment firms and display manufacturers based in Korea.
Micron’s current recruitment push echoes an earlier effort from late last year, when it conducted in-person interviews with Korean engineers in hotels situated in Pangyo, a suburb of Seoul.
Those interviews yielded promises of salary increases ranging from 10 to 20 percent, alongside visa support and housing assistance. In addition, Micron sought Korean talent earlier this year for its facilities across Japan, Singapore, and the U.S.
Strategic Imperatives and Market Context
Analysts perceive this recruitment escalation as part of Micron’s strategic endeavor to bridge the technological divide with its Korean counterparts in the HBM segment.
HBM is a critical memory variant essential for powering advanced AI systems, notably those implemented in Nvidia’s accelerators. Presently, Micron occupies the position of the second supplier of HBM3E (the fifth-generation HBM) to Nvidia, trailing SK Hynix.
In its quest to bolster manufacturing capabilities, Micron is enhancing HBM and DRAM production across its various facilities located in Taiwan, Japan, the U.S., and Singapore.
The high-margin HBM products are poised to become a significant growth catalyst for the company. CEO Sanjay Mehrotra articulated last month that the global HBM market is projected to burgeon to $100 billion by 2030, markedly outpacing the growth trajectory of conventional DRAM.
“We’ve delivered customer samples of HBM4 boasting bandwidth up to 11 gigabits per second per pin, surpassing competitors’ capabilities,” Mehrotra stated, further indicating that mass production and shipments of sixth-generation HBM4 are slated to commence in the second quarter of next year.
Currently, SK Hynix dominates the global HBM market and is reportedly finalizing supply agreements with Nvidia for its HBM4 products. Concurrently, Samsung Electronics is nearing the culmination of its HBM3E certification process and is preparing for HBM4 production.
As the global competition in AI hardware intensifies, Micron’s recruitment strategy for experienced Korean professionals highlights the increasing significance of human capital in the quest for supremacy in high-end memory technology.
Source link: Koreabizwire.com.
